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MCM LQPF-64
14 x 14 mm
RX/TX 2 Ghz
Substrate: 2 Layer
Devices: 1 Custom Chip, 1 SOT-23 Regulator
Passives: 2 Chip Capacitors, 4 Ferrite Beads
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Fiber Optic RX/TX
22 pin, 33 x 33 mm
Substrate: 4 Layer, Impedance Control
Devices: 3 Custom Chips
Passives: 20 Chip Caps, 5 Resistors, 3 Beads
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Hestia was founded in 1983 with its primary focus on package technology development for advanced semiconductor IC packages. During the early years Hestia developed many new advanced packages, like a low cost PPGA, the first fully molded PPGA and the first multi-chip module. Twenty years later Hestia continues the tradition of developing state of the art packages and new packaging technology concepts. Present capabilities include package design, package development, process development, prototypes through production, package sub-assembly manufacturing along with capability for technology transfer.
HESTIA’S CORE COMPETENCY INCLUDE
PACKAGE DESIGN -- Semiconductor substrates, Lead Frames, Sensors, Multi Chip Packages and Multi Chip Modules.
SUB-ASSEMBLY MANUFACTURING -- Substrate Attach to Lead Frames, Heat Sink Attach, SMT, Passives Attach and Pin Insertion Capabilities.
MOLDING-- Tool Design, Open Cavity Packages, Biometric, Sensors, Molded Compact Flash Cards and Molded Underfill Technology for Flip Chip Packages.
DISPENSING TECHNOLOGY -- Used to dispense solder paste, B-stage epoxy and silver epoxy for application such as package lids, attaching passives to substrates and for attaching heats sinks to lead frames. Further development of this technology is underway for attaching heat sinks to BGA substrates and substrates made from polymer thick film and LTCC.
SENSOR TECHNOLOGY -- Hestia has developed and produced a variety of packages for CCD and Biometric applications in packages where exposed die surfaces are required bring many new challenges.
SURFACE MOUNT TECHNOLOY (SMT) -- Based on the growth in the market for package integration for SIP, MCM, MCP and Bluetooth packages, Hestia has expanded it's capability and capacity for passive and active component attach.
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MCM BGA-313
35 x 35 mm
Substrate: 6 Layer with Buried, Blind and Through Via Holes
Devices: Microprocessor, DSP, 2 SRAM, 430 Wires
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HESTIA TECHNOLOGIES, INC.
990 Richard Ave Suite 109
SANTA CLARA, CA 95050
PH 408-844-8675 FAX 408-844-8676
WEB SITE www.hestiatechnologies.com
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