ISI Delivers 3D & Advanced Packaging

that is Cost Effective at Any Quantity

You don't need cell phone production volumes to miniaturize and cost reduce your next design using the latest packaging technologies.

Your one stop shop: 3D, stacked die, multi-chip modules, package in/on package, high-density memory modules, hybrid assembly, chip on board, flip chip, and more.. Reduce your concept-to-production cycle times with our cost-effective, U.S.A. based multi-discipline design teams and vertically-integrated manufacturing. Turnkey or co-developed design services capabilities. ISI's extensive installed base includes industrial, medical, mil/aero, datacom, telecom, automotive, and consumer applications.

Select the Advanced Packaging links in the left menu

to view solutions for applications just like yours.