COMPANY PACKAGING MILESTONES
1983: Hestia Technologies formed as a California Corporation
1984: Developed pinning process for PPGA packages
1984: Achieved production status delivering 100,000 68 PPGA packages/month
1985: Introduced first multi-layer (4 layers) 176 PPGA package
1985: Introduced first PPGA using single tier interdigitated bond fingers
1986: Introduced dual tier bond shelves in PPGA package
1986: Introduced first multi-layer PPGA (6 layers) with copper heat spreader
1987: Developed a 360 pin 9 layer PPGA
1988: Initiated development of a multi-layer PLCC & QFP plastic package
1989: Developed a 500 pin surface mountable PPGA package
1989: Introduced first commercially available fully molded PPGA
1989: Introduced the first multi-chip PPGA package
1989: Introduced the first multi-layer high performance EIJA HP-QFP package
1990: Initiated development of plastic molded LGA packages
1990: Introduced low cost multi-chip PQFP and PLCC packages
1991: Introduced Thermal Quad a low cost thermally enhanced PQFP package
1991: Introduced multi-layer Solder Grid Array (BGA) package
1992: Transferred state-of-the-art laminate substrate manufacturing technology to a world class Japanese board supplier
1992: Introduced High Performance Solder Grid Array (BGA) package
1993: Developed molded PCMCIA card
1993: Pioneered double sided assembly of MCM’s in a standard package format
1994: Signed technology agreement for laminate substrate technology with a Taiwan Mfg
1995: Signed second source agreement with a Taiwan manufacturer for Hestia packages
1996: Signed technology and license agreement with a major Japanese manufacturer for use of the Hestia molding technology for PPGA and PGBA packages
1997: Developed a multi-chip thermally enhanced 100 watt digital power amplifier package
1998: Completed development of Molded Underfill Technology for flip chip packages
1999: Developed a memory stacking interposer package for 1 Gigabit memory card
1999: Developed molding technology for Biometric packages
2000: Signed worldwide license agreement for MUF™, patented technology with Cookson Semiconductor Packaging Materials
2001: Completed joint patent filing for Biometric fingerprint ID package with AuthenTec.
2002: Completed technology license and transfer of Hestia's embedded technology to China.

PATENTS --Sixteen patents issued to Hestia with additional filings under review
Multi-tier laminate substrate/internal heat spreaders...5,597,643
Apparatus for encapsulating electronic packages...5,609,889
Method of making multi-tier laminate substrates...5,622,588
Transfer molded electronic packages...5,652,464
Molded standard electronic packages & apparatus...5,689,137
Method for making multi-tier substrates with internal H/S...5,728,248
Method of transfer molding electronic packages...5,766,986
Apparatus for encapsulating high performance packages...5,776,512
Method of making multi-tier laminate packages...5,798,014
Semiconductor Non-laminate packages & method...5,959,522
Chip package with molded underfill...6,038,136
Transfer molded PCMCIA standard card...6,128,195
Chip package with transfer molded underfill...6,157,086
Method of fabricating a Non-laminate substrate...6,316,291
Chip Package with molded underfill...6,324,069
Method of underfilling an Integrated circuit chip...6,495,083

TRADEMARKS
MUF™ Molded Underfill Solution