MCM PLCC-68 24 x 24 mm Substrate: 4 Layer Devices: 4 SRAM MCM PQFP-160 28 x 28 mm Substrate: Multi-tier, 4 Layer Devices: 1 Microprocessor, 1 ASIC, 300 Wires PC POWER SUPPLY PQFP-80 14 x 20 mm Substrate: 2 Layer Devices: 1 Custom Power Chip, 1 Power Diode Passives: 8 Chip Capacitors, 1 Chip Resistor MOLDED HIGH PERFORMANCE PPGA-168 Substrate: 4 Layer Heat Sink: Copper, Molded Dam Ring Device: 486 Microprocessor

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