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 A Patented Molded Underfill Solution(MUF™) for BGA, CSP and Flip Chip packages. This is a complete molded under process for peripheral array, partial array and full array flip chip packages. Some advantages of this Molded Underfill process increases productivity since it is a more automated, simple, robust and fast process. Better reliability since molding has a higher Tg and lower CTE. This process uses Conventional Molding Technology and is an extension of the traditional EMC molding process and since it uses existing Molding Equipment it is a lower cost solution. For additional information click on the link below. www.cooksonsemi.com | |||||
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990 Richard Ave Suite 109
SANTA CLARA, CA 95050
PH 408-844-8675 FAX 408-844-8676
WEB SITE www.hestiatechnologies.com