Press Release
Hestia Technologies, Inc. moves to new larger Facility

September 8, 2002

Santa Clara, CA - August 29, 2002 - Hestia Technologies, Inc. has signed a long-term lease and has completed the move to a new larger facility located at 990 Richard Ave. Suite 109 Santa Clara, CA 95050. The new facility will enable Hestia to significantly increases it's manufacturing space and to further expand its production capacity of MCM style packaging including passive component attach (SMT).

Hestia Technologies started in 1983 is a supplier of custom packaging for MCM, MCP, SMT, flip chip, biometric and high speed memory stack packaging. In addition to licensing technologies for embedded lead frames, molded underfill for flip chip, EBGA and pre-molded technology, Hestia's capabilities include lead frame substrate attach, mold design along with package development, electrical and thermal management solutions and is capable of supplying a turnkey solution for assembly and test.

For further information, please contact Hal Shoemaker At 408-844-8675 e-mail Hal@hestiatechnologies.com or visit the Hestia website at www.hestiatechnologies.com