Next Level Integration brings together multiple interconnect design and assembly disciplines generally not utilized together in traditional designs.

Next Level Integration is an effective tool to improve performance, lower costs and accommodate unique packaging applications.

ISI has broad design and process development knowledge coupled with extensive manufacturing assets that enable us to quickly execute on Next Level Integration projects that would typically require multiple suppliers and much more time.

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1988
Company founded to design, manufacture and market high pin count PPGAs.

1992
Designed and manufactured 557 I/O PPGA for GaAs die used in supercomputer,
telecom equipment, and semiconductor test applications.

1993
Awarded patent for surface mounting pins to a substrate.

1997
Selected by IBM/Motorola/Apple to build PowerPC modules for Apple G3 computers.
Ramped production from 250 parts per day to 10,000 per day in a four month period.
Manufactured over 4 million Power PC modules through program life.

1999
Ranked No.58 on Inc. 500 Magazine’s list of America's fastest-growing privately held companies.

2000
Designed and tooled initial socket contact for HiLo™ Flexible Interconnect System.

2000
Acquired BetaFlex of Camarillo, CA, specializing in bare die assembly and flex circuit assembly.

2000
Received ISO 9001:2000 Certification for manufacturing facilities in Camarillo, CA.
ISO Certificate

2001
Acquired Emulation Technology (ET) of Santa Clara, CA, a leader in the adapter and test accessory market. Emulation Technology has one of the broadest product offerings providing well over 4,000 interconnect products to design and development engineers.

2002
Refocused our strategy to meet the emerging market for Integrated Packaging Solutions.

2005
Acquired Comm Con Worldwide, a custom connector manufacturer with a complete
tool shop, mold making, injection blow molding and assembly equipment capabilities.

2005
Purchased an additional 22,000 square foot building in Camarillo business park,
increasing overall square footage to over 90,000.

2008
Acquired Nallatech, Inc. of Cumbernauld, Scotland, an established leader in FPGA innovation, delivering optimized processing capability required for challenging Defense applications, such as SIGINT, SDR and Unmanned Systems.

2008
ISI receives ITAR registration from the United States Department of State
ITAR Registration

2009
ISI acquires Hestia Technologies of Santa Clara, CA, bringing more than 25 years experience in semiconductor packaging and 19 issued patents to the ISI portfolio. The acquisition added several new technologies, along with a focus on high density, 3D memory packaging.

2009
Received ISO 9001:2008 Certification upgrade for two manufacturing facilities in
Camarillo, CA.
ISO Certificate

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