• Broad Capabilities
  • Design
  • Advanced SMT
  • Bare Die Assembly
  • Connector MFG
  • Quality
  • Testing & Inspection
  • Facilities Tour
• Custom Modules
  • Cost Reduction Modules
  • Fan-Out Interposers
  • BGA Termination Modules
  • ASIC Emulation Modules
  • Q Stack Power Delivery
• Interconnect
  • Custom Interconnect
  • HiLo Interconnect
  • Standard Connectors
  • Power Supply Sockets
• Advanced Packaging
  • Stacked & Multi Die
  • 3D Memory Packaging
    
  • Optical Die Packaging
  • IC Packaging
• Obsolescense Solutions
  • BGA Adapters
  • Leadframe Adapters
  • PGA - DIP Adapters
• RoHS Lead Free Solutions
  • BGA Reballing
  • BGA Interposers
• Flex Circuit Assemblies
  • Flex Assemblies