Interconnect Systems, Inc.
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Design Capabilities

Concept Development and Feasibility

ISI performs best when we engage with customers at the concept development stage.  For new projects, we quickly assign a project manager and a technical team with the experience required for the project.  Through web-meetings and face-to-face meetings, we explore a number of alternatives to arrive at a concept that best fits the application.

We encourage customers to visit our facilities to meet our team and see our capabilities in person.  Our team has hundreds of years of experience in a wide variety of electronic interconnect challenges that can be leveraged to help make your project a success.
 
Design Patents
ISI owns 29 U.S. Patents for products and processes with additional filings under review.
 

PCB Design and Sourcing
IC package substrate and PCB module design
High speed digital signal routing
    - Differential Pair, Controlled Impedance,
    - Matched Length, Maximum Length
Mixed Digital/Analog/RF designs
Broad Substrate / PCB Vendor Base
High Density Designs
    - Fine Line & Space
    - Blind & Buried Vias
    - Microvias
    - Build-Up Technology

FPGA Systems Design
FPGA sensor processing & accelerated computing solutions
Extremely high signal count interconnect, 2400 position+ Complete hardward design capability
- Memory Interfaces, DDR, SRAM, Flash
- Host interfaces: PCIe, FSB, VXS
- High speed analog/RF ADC & CDA design
- High speed serial I/O & ethernet
FPGA IP cores and firmware design
Software drivers and interface design
- Windows, Lunix & VxWorks

Advanced Interconnect Design
Large surface mount connectors with tight coplanarity and flatness specifications
Extremely high signal count interconnect, 2400 position+
Module-level interconnect compatible IC packages: 
- BGA, LGA
- QFP, SOIC
- MicroPGA, PGA, DIP
Multi-gigabit interconnect
Mixed pitch interconnect
High current / power interconnect

Physical Design
Design of assembly to fit within x, y & z 'envelope'
Geometric Dimensioning and Tolerancing
Compatibility with next-level manufacturing process
    - Interconnect specifications for coplanarity, true position,
      flatness (BGA, PGA, Leadframe)

DFR - Design for Reliability
Material & process selection
Substrate material, stackup and finish
Solder selection for RoHS & Non-RoHS applications
Adhesives, Epoxies, Overmolding

DFM - Design for Manufacturability
Component placement for 'tight designs'
Solder land pad geometry and solder volumes
Process Automation for non-standard assembly
Reflow profile development
Throughput analysis

DFT - Design for Test

Product Packaging for High Volume Assembly
Many ISI modules are shipped in packaging compatible with automated assembly processes:
JDEC Tray (custom if required)
Tape & Reel
Capabilities Overview.PDF




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