Downloads

Exhibition & Conference Schedule

ISI Brochure
ISI's latest 16 page color brochure highlighting Next Level Integration projects,
FPGA Systems Design, High Density 3D Packaging, Obsolescence Solutions, Advanced Packaging, HiLo, Adavanced Interconnect and our Integrated Capabilities.
ISI Brochure.PDF (10MB) For high quality hard copies please contact us.

ISI Overview
A comprehensive 40 page overview of ISI's Next Level Integration approach to innovative design, product solutions, ISI's skill set and multidiscipline manufacturing.
ISI 2009 Overview.PDF (14 MB)

ISI Capabilities Overview
A printable 5 page overview of ISI's Design, Process, Manufacturing, Inspection & Testing capabilities in more detail than the ISI Brochure.
ISI Capabilities.PDF (3MB)

High Density 3D Packaging
A 7 page overview of ISI's unique approach and combination of technologies to achieve miniaturized high density packaging.
ISI 3D Memory Pkg.PDF (5MB)

Reballing
A 30 page process review and slide show covering ISI's Reballing services and Certified statement of work.
ISI Reballing.PDF (2MB)

Footprint Conversion Adapters & IC Obsolescense Solutions
ISI designs approximately 150 new adapters each year to solve IC obsolescence and shortages for customers such as Agilent, BAE, Cisco, Fairchild, Harris, IBM, Lucent, Motorola, Nortel, Texas Instruments and Xerox footprint Conversion Adapters.
ISI Footprint Conversion Adapters.PDF

Fan-Out Interposers
A recently ISI published white paper highlighting the speed-to-market and cost advantages of using an interposer to convert microBGAs to standard pitch BGAs
Fan-Out Interposer White Paper.PDF

HiLo
ISI’s Flexible Interconnect System
for both Board to Board and BGA Socketing applications.
HiLo Guide.PDF
HiLo Standard Products & Drawings

Q Stack
Reviews this decoupling method that conserves board space and improves power delivery.
ISI Q Stack.PDF

PC104 & PC104 Plus
ISI PC104 Data Sheet.PDF
ISI PC104 General Specifications.PDF
ISI PC104 Standard Products & Drawings

ISI New Product Profiles
Recent New Product Communications
Sept 2008 IC Package Solution
June 2008 IC Obsolescence Adapter

ISI Print Ads
ISI Reballing.GIF
ISI Next Level Integration.GIF
ISI Obsolescence Solutions.GIF
ISI Fan Out Interposer.GIF
ISI Power Supply Sockets.GIF
ISI HiLo.GIF

Educational Materials
A reference to microelectronics acronyms & terminology.
Microelectronics Terminology