Exhibition & Conference Schedule

News Release
ISI Now Certifies Reballed Parts and Offers Automated Optical Inspection
ISI’s process of removing lead-free (RoHS) solder spheres then attaching leaded Sn63Pb37 eutectic spheres, has been qualified by leading Commercial, Industrial, Military and Aerospace companies.  ISI has advanced their reballing process to the extent they can now certify that the silicon is protected to specific parameters throughout the process as follows:
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News Release
ISI FlexFrame™ Adapters Offer Low Cost IC Obsolescence Solutions
Today, many of the ICs going obsolete are in SMT gullwing and j-lead packages such as QFPs, PLCCs, TSOPs, and SOICs.  ISI has developed a new interconnect system, FlexFrame™ to enable footprint conversion adapters that replace this family of packages.
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News Release
ISI Offers Unique Power Supply Socketing System
Interconnect Systems announces a practical alternative to power supply interconnect.
The ISI socketing design allows for easy power supply attach, removal, rework and replacement.
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News Release
ISI Fan-Out Interposers Reduce PCB Assembly Costs Associated with Micro BGAs
Fan-out interposers convert fine pitch BGAs to a larger pitch eliminating the additional costs associated with microvias and underfilling on the PCB. They allow the designer to continue using the optimum IC for the design, the fine pitch BGAs, and reduce overall system costs.
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News Release
ISI Increases Reballing Capacity And Implements 100% Optical Inspection In response to the increasing demand for reballing, ISI has made substantial investments in process and capacity upgrades including automated 100% optical inspection. ISI’s process of removing lead-free (RoHS) solder spheres then attaching leaded Sn63Pb37 eutectic spheres, has been qualified by leading Commercial, Industrial, Military and Aerospace companies.
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News Release
ISI Delivers Custom Mixed Pitch Interconnect in 3 Weeks
ISI announces rapid turn-around time for custom interconnect solutions for board-to-board and or mezzanine card applications. ISI’s HiLoTM Flexible Interconnect System can be designed in 48 hours, delivering sample parts in 2 weeks and full-scale production in
3 weeks.
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News Release
ISI Boasts 72-Hour Turn-Around for PC104 Board-to-Board Interconnect
Interconnect Systems, Inc. responds to increasing demand for PC104 & PC104 Plus Press Fit connectors with higher inventories and a 72-hour turn-around time.
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